EVGA RTX 3090 FTW3 Ultra Troubleshooting Help

No of course it is cooler. No question about it. My biggest worry is that it was running 98-100 C before the reinstall. Now I re-did everything again with extra pads and ensured that everything is properly intact and touching by checking marks etc. Still memory junction temperature is 110 C. I have now done this five times over. Last time possibly the VRAM wasn't touching everywhere but now there is no excuse. My memory temps are still lower than before. But memory junction isn't so really not sure wtf is going on now. :nuts:
 
Seems like 6th time is a charm. I figured out it was the backside ram chips that had the pads not fully cover them. I fixed all of them now and temps are down to 100-106 C without fan going ape shite. Going to run it for a day and see what's up. I do think I need the new pads to pad up the front side as well. At least the fan isn't ramping up and mostly staying in the 100 C area. Also today is a much hotter day than other days. Turned on the AC to see if this is fixed for now. Maybe I can try reinstalling the hybrid once my new thermal pads are here. :bleh:

What a disaster this GDDR6X is.
 
It is. I need to re do the whole pads on memory chips. I ordered thermal right pads so will need to wait on those. Until then this seems like an OK compromise.

This Arctic stuff isn’t all that good.
 
Make sure you bought the right size thickness pads.. if you didn't, they won't do anything.
 
Nunz said:
Make sure you bought the right size thickness pads.. if you didn't, they won't do anything.
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I got 1.5 mm and would need to double them up. The sizes EVGA uses are all out of stock. They use 2.85 mm for VRM and 2.5 mm for VRAM. Backside is 2 mm. So I am hoping w/ 1.5 mm there will be sufficient squidgy room to compress them.

Presently, I have 1.5 mm Arctic pads squished up w/ EVGA stock pads. It is doing an OK job of keeping the card cool. EVGA stock pads can easily go from whatever mm they are to about 0.5 mm squished when I measured.

I ordered 2 packs of this with 1.5 and 1 mm thickness.
 
People have started doing this whole stacking of thermal pads thing but IMO, not good to do that. There's no way the thermal transfer is going to work as advertised with stacked pads.

It's important to not be too thick on the VRM or VRAM chips around the core die because if they're too thick, you end up hurting the copper-to-die contact and it spikes your core temps.

If you're going to stack pads, I would do your best to get them as close to the actual size as possible. I'm not sure how compressive the thermalright pads are, but I think I read that they don't squish very well; part of the reason their thermal transfer is so high.
 
I am applying thermal paste on the pads (MX-4) to have a layer for transfer. I can't seem to find decent 2.5 mm or 3 mm pads that have high transfer. Best I found was 2 Watts lol. Even the Thermal Grizzly minus 8 (8 W) is only available in 1.5 mm size.

Right now I am stacking pads and my memory temps and power temps are exactly as per stock. The only one (where I haven't stacked) are the front chips and I am damn sure it is what is causing the 100-106 C junction temps. I also didn't apply thermal paste on those pads (between pad and copper).

I am going to re-do the whole thing when these pads are here. I don't know of a better thermal pad so if you know of one I am happy to go ahead and order that. I also tried finding out if I can order stock thermal pads same from EVGA and couldn't find it. If all else fails the last thing I will do is remove all pads from the hybrid kit and install those on the stock HSF. It will suck ass to do that but oh well, what can you do?
 
The pads from the hybrid kit may be different thickness though. You'd have to check prior to installation.

The Thermalright pads are the best I know of that are available. Fujipoly are the be-all-end-all of thermal pads, but they're extremely expensive and shipping/availability is a nightmare, even prior to the pandemic. They are the best performing pads though. The Thermalright pads aren't too far behind, but nothing touches the Fujipoly.

Judging by your post, seems like you have a good idea of what's causing the high junction temps. I've thought about replacing the thermal pads on my 3080 and using liquid metal on the die, but I just can't be bothered to take the cooler off. Too much time for minimal or no gains.
 
Fuji is 11 watts and their sizes vs price just doesn’t make sense to me.
Honestly if your card is running fine don’t touch it. Lesson learnt. :bleh:
 
Nope. Keeping it. I might give it a go when I change my case down the road.
 
Thinking about re-doing the front pads tonight :bleh:
I have pulled apart this card now 6 times and it seems it will only take me 15 mins to do the whole thing. :lol:
 
Next time I do it, will take more shots. Can’t do it tonight. I already strained my back due to lifting this crap multiple times and standing for hours working on the card. First time it took so long. Now I don’t even know why it took that long lol. I think it were the bitch screws with nuts that you have to re do each time. Completely unnecessary and a very poor design from EVGA.
 
KAC said:
I am applying thermal paste on the pads (MX-4) to have a layer for transfer. I can't seem to find decent 2.5 mm or 3 mm pads that have high transfer. Best I found was 2 Watts lol. Even the Thermal Grizzly minus 8 (8 W) is only available in 1.5 mm size.

Right now I am stacking pads and my memory temps and power temps are exactly as per stock. The only one (where I haven't stacked) are the front chips and I am damn sure it is what is causing the 100-106 C junction temps. I also didn't apply thermal paste on those pads (between pad and copper).

I am going to re-do the whole thing when these pads are here. I don't know of a better thermal pad so if you know of one I am happy to go ahead and order that. I also tried finding out if I can order stock thermal pads same from EVGA and couldn't find it. If all else fails the last thing I will do is remove all pads from the hybrid kit and install those on the stock HSF. It will suck ass to do that but oh well, what can you do?
Click to expand...

Do not stack pads. The coolers are made for certain size thermal pads. Stacking pads adds pressure to the chips and can damage the board. Pads are built for 1 layer use. Not stacking.

And, just so I know, you were putting TIM on too?

Dude....
 
Pad to copper TIM won’t do ****. I am not stupid enough to try it on memory chips that can be ripped from the board.

Everyone and their mothers is adding pads because EVGA went out of spec for their pads. If they had used pads like normal humans use of sizes that are readily available then we won’t have these issues. Heck their own hybrid cooler came with pads that don’t work. Also I feel like I was one of the few lucky ones who got a card that was under 100 C memory junction while mining. Most are in the 106-112 C which is where I was until I stacked some pads.

Btw not only is EVGA suffering from this my ASUS TUF also hit 110 C junction temperature with fans hitting 100% speed. I have heard same happen on Gigabyte and MSI cards as well. P.S. my PCB is already a bit bent due to stacking. :bleh:

So stacking will have to do for now.
 
Been a full day now and I see that whatever I did is working. Typically my mining performance was about 0.000041XX or 0.000045XX per hour (across both 3090 and 3070). For past day my payments have increased to 0.000047XX to 0.000053XX. I don't know how but it happened. I can't believe it is just due to difficulty decrease or profitability increase on NH.

I also see routinely my hash rate is hovering in the 105-110 MH/s mark for the 3090 (used to be about 95-100 MH/s mark). This is because I run the Medium profile on NH which limits card at 80% power.

Can't wait for new thermal pads to be here. :drool:
 
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