X600 gen mobos leaking before tomorrows computex. 2 chipset io and tons of usb on some models is what comes off at first:
https://www.techpowerup.com/295068/a...ad-of-computex
https://www.techpowerup.com/295095/f...appears-online
https://wccftech.com/msi-x670e-godli...zen-7000-cpus/
2 versions of the x670- chipset. Something look out for.
https://www.techpowerup.com/295068/a...ad-of-computex
https://www.techpowerup.com/295095/f...appears-online
These pictures are often used to make sure things like the solder mask and components were applied properly during production. However, it does give us a good look at the overall layout of the ASUS X670 Prime-P WiFi and the fact that the X670 chipset does indeed consist of two parts. What is also clear is that we're looking at a PCIe 5.0 x16 slot here, as these slots are SMD components rather than through hole.
Other things that are clearly visible, includes support for three M.2 slots, of which the one closest to the CPU might be PCIe 5.0, but there's really no way of telling by just looking at the connector placement. There's also a space for a WiFi module at the bottom of the rear I/O, but beyond that, it's hard to make out the proper port layout. However, there appears to be at least one USB-C port at the rear, as well as a header for another one at the front of the motherboard, next to a USB 3.0 header. The board also appears to feature 14 power phases and obviously four DDR5 DIMM slots. The chip between the two chipsets are either a Super I/O chip or possibly a PCIe redriver. In addition to the x16 PCIe 5.0 slot, the X670 Prime-P appears to be getting a single PCIe x1 slot and two PCIe x4 slots, both which appear to get physical x16 slots.
Other things that are clearly visible, includes support for three M.2 slots, of which the one closest to the CPU might be PCIe 5.0, but there's really no way of telling by just looking at the connector placement. There's also a space for a WiFi module at the bottom of the rear I/O, but beyond that, it's hard to make out the proper port layout. However, there appears to be at least one USB-C port at the rear, as well as a header for another one at the front of the motherboard, next to a USB 3.0 header. The board also appears to feature 14 power phases and obviously four DDR5 DIMM slots. The chip between the two chipsets are either a Super I/O chip or possibly a PCIe redriver. In addition to the x16 PCIe 5.0 slot, the X670 Prime-P appears to be getting a single PCIe x1 slot and two PCIe x4 slots, both which appear to get physical x16 slots.
According to the leak, the pictures give us a first look at the design of the MSI MPG X670E Carbon WIFI while also detailing the I/O of the flagship MEG X670E GODLIKE and X670E ACE offerings. The lineup also features a singular PRO offering, the X670-P WIFI which will come with both PCIe Gen 5.0 and 4.0 support while the X670E offerings will feature all PCIe Gen 5.0 support. The board does look like it comes with a massive VRM heatsink with a new logo design & the picture also confirms a Lightning Gen 5 M.2 port on the Carbon along with the PCIe Gen 5.0 x16 slot.
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